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SODIAL(R) 5g Premium Thermal Compound paste for Power LED, CPU, PC XBOX 360
Thermal Conductivity: Greater than 5.15 W/m-K
Thermal Impedance : Less than 0.004Degrees Celsius-in2/W
Specific Gravity: Greater than 3.25g/cm2
Viscosity : 125000
Thixotropic Index 280±10 1/10mm
Moment Beared Temperature:-50 - 340Degrees Celsius
Operation Temperature:-30 - 280Degrees Celsius
Ingredient Percentage Composition
Silicone Compounds 10%
Carbon Compounds 45%
Metal Oxide Compounds 45%
Please note that this is a compound not a thermal glue
Package Contents: 1 x thermal paste
Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.
Applicable to LED, CPU, PC XBOX 360
highly effective solution to transfer heat away from your components directly to a heat sink.
The utilisation of a good quality high thermal conductive compound is essential to keep components cool, prolong their life and allow them to perform at optimal levels.
Each syringe contains 5g of premium thermal compound that will be enough for the installation of around 40 x 1W / 3W LEDs with PCB when mounted directly onto a one of our Heatsinks