Made of high quality Aluminum, good thermal conductivity
Reduce the risk of hardware failure due to overheating
Maximize surface area Designed in contact with the cooling air. The 23pcs fins increase the area of the board and thus provide for greater heat transfer
Widely used for computer, Power Transistor, FET, IC, Power Amplifier, Voltage Regulator, MOSFET, SCR etc.
Please make sure that the size of the heat sink fits that of your component