INSMA 30cm x 5M PCB Photosensitive Dry Film For Circuit Production Photoresist Sheets

Price:
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Manufacturer Description

Photographic dry film is used to make PCB board, stick it on PCB to make a sensitive circuit board.
Feature:
Masking capacity: 0.25inch
Thickness: 38±2um
Size: 500cmx30cm
High resolution
Easy to fade and filter
Good contrast before and after exposure
Etching:
The dry film is resistant to most of the acid etching solution, the PH value can be resistant to most alkaline etching solution between PH8.0-8.5.
Cover hole:
1.5 mil dry film can fully cover a 0.25 inches thickness hole.
Plating:
The dry film is available in most common use of the plating bath, no wrinkles, no color.

Package Included:
1x photosensitive dry film/in a pack.

Suggestions for use
1. Foil parameters
Temperature of reel : 100~120?(210~248?)
Pasting speed: 1.0~3.0m/min (3~10feet / min)
Pasting pressure: 35~50psi
Plate temperature: 40 to 65?(105 to 149?)
2. Exposure parameters
Exposure energy: 30-70mj/cm2
After exposure time: 15min
If it can maintain the pH?10.6 (dissolved about 2.0 mil-ft2/L), it can get a better quality of production.
3. Developing parameters
Developer concentration: 0.8-1.2% Na2CO3•H2O
Developer temperature: 28 to 32?(82 to 89.6?)
Developing time:40~48 seconds (28?/82.4?)

Using Warning:
1. There will be organic solvent evaporation film, the room should maintain a good ventilation.2. Dry film must be opened in the yellow light operation.
3. Both PE and PET protective film can not be used again after open.
4.If a film after plating needs to be placed more than 24 hours, please use a black film or other shading to block light.
5.Because the non-photosensitive dry film contains acrylic monomers, may cause skin allergies, especially those who are more susceptible to allergies.

Storage:
Should be placed in the temperature of 5?--20?(41?-68?), humidity 50%±10% of the environment, to reach the longest shelf life and validity.

Product Features

HIGH SENSITIVITY and RESOLUTION can greatly improve production capacity. Excellent adhesion to ALMOST ALL SURFACE, pattern is CLEAR after exposure..High Resolution FAST and excellent film REMOVAL performance. Excellent HOLE-COVER and ANTI-PLATING ability. Suitable for plating, hole covering and the etching process.

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